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- Professor
- Name (English):Yongpan Liu
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- Business Address:清华电子罗姆工程馆
- Degree:Doctoral degree
- Status:Employed
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Yongpan Liu received the B.S., M.S., and Ph.D. degrees from the Electronic Engineering Department, Tsinghua University, Beijing, China, in 1999, 2002, and 2007, respectively. He is currently a Full Professor with the Department of Electronic Engineering, Tsinghua University, enrolled by Chang Jiang Scholars Program of Minister of Education of China.
Prof. Liu is a Program Committee Member for ISSCC, ASSCC and DAC. He has received under 40 Young Innovators Award DAC 2017, Best Paper/Poster Award from ASPDAC 2021, 2017, Micro Top Pick 2016, HPCA 2015, and Design Contest Awards of ISLPED in 2012, 2013 and 2019. He served as General Secretary for ASPDAC 2021 and Technical Program Chair for NVMSA 2019. He was Associate Editor of the IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, the IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS—II, and the IET Cyber-Physical Systems. He is an IEEE Senior Member. He served as A-SSCC2020 tutorial speaker and IEEE CASS Distinguished Lecturer 2021.
- Lecture and Assistant Professor , Dept. of Electronic Engineering , Tsinghua University 2020-4-16 ∼ Now
- 长聘副教授，研究员 , 电子工程系 , 清华大学 2017-4-16 ∼ 2019-4-16
- 访问学者 , 计算机科学系 , 香港城市大学 2017-4-16 ∼ 2017-6-16
- 访问学者 , 计算机科学系 , 美国宾夕法尼亚州立大学 2014-7-16 ∼ 2014-9-16
- 助理研究员和副研究员 , 电子工程系 , 清华大学 2007-4-16 ∼ 2016-4-16
- Tsinghua University, Electronic Engineering, Doctoral degree 2004-9-16 ∼ 2007-6-16
- Tsinghua University, Electronic Engineering, Double Degree 1995-4-16 ∼ 2010-6-16
- Reviewer of IEEE Trans. VLSI ASICON05, ICIC06, APCCAS06, ICCCAS06, GLSVLSI07, CF07
- Member, IEEE, IEICE
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CONFERENCE
ICCCAS 2009 TPC
ICGCS2010 TPC
MOBILE Version