Associate Professor
Supervisor of Doctorate Candidates
Supervisor of Master's Candidates
E-Mail:xueqingli@tsinghua.edu.cn
School/Department:Department of Electronic Engineering, Tsinghua University
Administrative Position:Associate Professor
Education Level:Postgraduate (Doctoral)
Business Address:4304 EE Building, Tsinghua University, Beijing 100084, China
Degree:Doctoral degree
Professional Title:Associate Professor
Alma Mater:Tsinghua University
ZipCode ：100084
PostalAddress ：4304 EE Building, Tsinghua University, Beijing 100084, China
OfficePhone ：62780591
Email ：xueqingli@tsinghua.edu.cn
（Department of Electronic Engineering） Tsinghua University
（Department of Electronic Engineering） Tsinghua University
（Department of Electronic Engineering） Tsinghua University
（Computer science department） Pennsylvania State University, USA
Editor for Journals：
Guest Editor, IEEE Journal of Solid-State Circuits (JSSC), 7/2024
Guest Editor, IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS), 2025
Associate Editor, IEEE Transactions on Very Large Scale Integration Systems (TVLSI), 4/2023
Associate Editor, IEEE Transactions on Emerging Topics in Computing (TETC), 7/2023
Associate Editor, Journal of Electronics & Information Technology , 3/2023
Associate Editor, Journal of Microelectronics, 12/2024
Associate Editor, Journal of Moore and More, 12/2024
Review Editor of Frontiers in Electronics
Organizing committee member of COINS2020, NANOARCH 2019, GLSVLSI2019, TRIFIA 2018, ICWR2018
IEEE Senior Member
TPC member of ISSCC, DAC, ICCAD, ASP-DAC, AICAS, ISCAS, GLSVLSI, ISVLSI, NVMSA, CASES, ISEDA, CAD-TFT, IFETC, NANOARCH, PRIME, TRIFIA
Session/Track Chair/Co-chair of ASP-DAC2024, DAC2023, ITC2021, GLSVLSI 2020, CAD-TFT 2020, ISVLSI 2019, NANOARCH2019, DAC 2018, ISVLSI 2018, TRIFIA 2018
Paper reviewer for Journals: Science, Scientific Reports, Nature Communications, JSSC, TCAS-I, TCAS-II, TVLSI, TCSVT, TCAD, TNANO, TMTT, EDL, TED, IEEE Micro, JEDS, JETCAS, OJCAS, IEEE ACCESS, JCSC, JxCDC, etc.
